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micro gch08 LATVIA

micro gch08 LATVIA

Microvia - WikipediaOne challenge for high density interconnect board development, is to fabricate reliable microvias, especially for stacked microvias, without resulting in incomplete filling, dimples, or voids in the copper plating process. The authors of have been investigating the risk of microvias in terms of voids and other defects using both experimental testing and finite element analysis.

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